Thermal Grease YNPJ Compound Silicone CPU Heat Sink Cooling Paste-0.5g

Product Overview:
A high-performance thermal compound designed to improve heat dissipation between CPUs, GPUs, and their heat sinks, ensuring optimal cooling efficiency.

Key Features:
‣ High thermal conductivity for efficient heat transfer.
‣ Low thermal resistance minimizes thermal impedance.
‣ Non-conductive material ensures safety for electronic components.

Technical Specifications:
‣ Material: Silicone-based compound (grey).
‣ Compatibility: Suitable for CPUs, GPUs, LEDs, and other electronic components.